Flip Chip is a method of connecting computer chips to circuit boards, where the chip is turned upside down (or "flipped") and directly attached. Think of it like connecting Lego pieces from the bottom instead of stacking them from the top. This approach is popular because it makes electronic devices faster and smaller compared to traditional wire connections. You might also see it called "C4 bumping" or "controlled collapse chip connection" in job descriptions. It's widely used in making smartphones, computers, and other modern electronic devices.
Supervised Flip Chip assembly line achieving 99.9% yield rate
Optimized Flip-Chip packaging process reducing defects by 40%
Led team of 15 technicians in FC (Flip Chip) manufacturing operations
Typical job title: "Flip Chip Process Engineers"
Also try searching for:
Q: How would you handle yield issues in a Flip Chip production line?
Expected Answer: A senior engineer should discuss systematic problem-solving approaches, including process monitoring, root cause analysis, implementing corrective actions, and establishing preventive measures to maintain high production yields.
Q: What experience do you have with qualifying new Flip Chip equipment?
Expected Answer: Should demonstrate knowledge of equipment qualification processes, including installation checks, process capability studies, reliability testing, and documentation requirements.
Q: What are the key quality control points in Flip Chip assembly?
Expected Answer: Should explain basic inspection points like bump height measurement, alignment accuracy, and final bond strength testing, along with typical acceptance criteria.
Q: Describe your experience with different Flip Chip bonding materials.
Expected Answer: Should be able to discuss common solder materials, underfill materials, and their applications, including basic advantages and disadvantages of each.
Q: What is Flip Chip technology and why is it used?
Expected Answer: Should be able to explain that Flip Chip is a method of connecting chips to circuit boards by flipping them upside down, and that it offers better performance and smaller size compared to traditional methods.
Q: What are the basic steps in the Flip Chip process?
Expected Answer: Should be able to describe the main steps: bump formation, chip flipping, alignment, and bonding, in simple terms without necessarily knowing all technical details.